X6 6in1 Mainboard Layering Heating Preheating Platform/Chip Positioning/Glue Removal For PHONE X XS XSMAX 11 PRO MAX Motherboard
Home » Phones & Telecommunications » Mobile Phone Parts » X6 6in1 Mainboard Layering Heating Preheating Platform/Chip Positioning/Glue Removal For PHONE X XS XSMAX 11 PRO MAX Motherboard
| Price from: | 51.18 $ |
| Prices are approximate and are indebted to the time of inclusion in the product catalog. | |
Description:X6 6in1 Mainboard Layering Heating Preheating Platform/Chip Positioning/Glue Removal For PHONE X XS XSMAX 11 PRO MAX MotherboardIntroducing the X6 6in1 Mainboard Layering Heating Preheating Platform, a versatile and essential tool for technicians and enthusiasts working with iPhone X, XS, XSMAX, 11 PRO MAX motherboards. This high-quality mainboard layering heating preheating platform offers a range of functions, including chip positioning and glue removal, making it an indispensable asset for repairing and maintaining these popular iPhone models. The X6 Mainboard Layering Heating Preheating Platform is designed with precision and efficiency in mind. Its heating element ensures even and controlled heating, allowing for safe and effective chip positioning. Whether you need to replace a damaged chip or perform intricate soldering work, this platform provides the stability and temperature control required for successful motherboard repairs. Additionally, the X6 Mainboard Layering Heating Preheating Platform excels in glue removal, which is crucial when working with iPhone motherboards. Its specialized heating mechanism softens the adhesive, making it easier to separate components without causing damage. This feature streamlines the repair process, saving valuable time and effort. In conclusion, the X6 6in1 Mainboard Layering Heating Preheating Platform is an indispensable tool for technicians and repair enthusiasts working with iPhone X, XS, XSMAX, 11 PRO MAX motherboards. With its chip positioning, glue removal, and layering heating capabilities, this platform ensures precision and efficiency in motherboard repairs. Invest in the X6 Mainboard Layering Heating Preheating Platform and |
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Created by: w-software.com | Dřevostavba svépomocí | Guitar Accesories | BMW F650 GS | LED bulbs
Digitální fotoaparát | Geolokace, IP location | Náramkové hodinky | LED žárovky | Minipočítače.cz | RC modely | Cheap Watch | Fotogalerie | Smartphone 1 | Burza domén | cooperate