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SOP4 (1.27) test socket with board to DIP high temperature resistant optical lotus chip aging socket plastic package burn in soc

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Enlarge SOP4 (1.27) test socket with board to DIP high temperature resistant optical lotus chip aging socket plastic package burn in soc
SOP4 (1.27) test socket with board to DIP high temperature resistant optical lotus chip aging socket plastic package burn in soc enlarge
SOP4 (1.27) test socket with board to DIP high temperature resistant optical lotus chip aging socket plastic package burn in soc enlarge
SOP4 (1.27) test socket with board to DIP high temperature resistant optical lotus chip aging socket plastic package burn in soc enlarge
SOP4 (1.27) test socket with board to DIP high temperature resistant optical lotus chip aging socket plastic package burn in soc enlarge
SOP4 (1.27) test socket with board to DIP high temperature resistant optical lotus chip aging socket plastic package burn in soc enlarge
Price from: 58.00 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

SOP4 (1.27) test socket with board to DIP high temperature resistant optical lotus chip aging socket plastic package burn in soc
Introducing the SOP4 (1.27) Test Socket with Board to DIP High Temperature Resistant Optical Lotus Chip Aging Socket Plastic Package Burn In Soc, a cutting-edge solution designed to enhance the testing and aging process of SOP4 (1.27) chips. This highly advanced test socket offers superior performance and durability, making it an indispensable tool for electronics manufacturers and testing laboratories.

Built with high temperature resistant materials, this test socket can withstand extreme heat during the aging process, ensuring accurate and reliable results. The optical lotus chip design provides excellent connectivity and precise contact, minimizing signal loss and maximizing efficiency. Its plastic package burn-in soc further enhances the durability and longevity of the socket, allowing for prolonged usage without compromising its performance.

The SOP4 (1.27) Test Socket with Board to DIP High Temperature Resistant Optical Lotus Chip Aging Socket Plastic Package Burn In Soc is easy to use and compatible with a wide range of testing equipment. Its ergonomic design ensures effortless installation and removal of chips, saving valuable time during the testing process. With its exceptional performance, durability, and compatibility, this test socket is the ideal choice for professionals seeking reliable and efficient testing solutions. Upgrade your testing capabilities with the SOP4 (1.27) Test Socket with Board to DIP High Temperature Resistant Optical Lotus Chip Aging Socket Plastic Package Burn In Soc and experience unparalleled accuracy and efficiency in chip testing and aging.

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